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Click on Data Sheet for further information
about:
-Part Number Details
-Socket
Dimensions
-IC Dimensions
-PCB
Layout
 Full Data Sheet
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| PDF file size:
85KB |
|
Title: Thin Small Outline Package (TSOP
II) |
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| Features |
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- Pin counts 20, 24, 26, 28, 40, 44, 50 and
54
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- Pitch sizes 0.8 and 1.27mm
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- Open top low actuation force socket,
depopulation possible
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| Specifications |
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| Insulation
Resistance: |
1,000M min. at
500V DC |
| Dielec.
Withstd. Voltage: |
700V AC for 1
minute |
| Contact
Resistance: |
30m max. at
10mA/20mV max. |
| Current
Rating: |
1A
max. |
| Operating
Temp. Range: |
–40癈 to
+170癈
(–40癈 to +150癈 for -004
type) |
| Mating
Cycles: |
10,000
insertions min. |
| Contact
Force: |
20g min. per
pin at min.
displacement of 0.3mm
80g max. per pin at max. displacement of
0.7mm |
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| Materials
and Finish |
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| Housing: |
Polyetherimide (PEI), glass-filled |
| Contacts: |
Beryllium
Copper (BeCu) |
| Plating: |
Gold over
Nickel |
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