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BGA封装老化测试座

CSP封装老化测试座

DIP封装老化测试座

PGA封装老化测试座

PLCC封装老化测试座

QFN(MLF)封装老化测试座

QFP封装老化测试座

QFP封装贴片测试座

SOJ封装老化测试座

SOP封装贴片测试座

SOP封装老化测试座

SOT / TO封装老化测试座

 

PGA老化测试座 PGA SOCKET

PGA (pin grid array) 陈列引脚封装。插装型封装之一,其底面的垂直引脚呈陈列状排列。封装基材基本上都采 用多层陶瓷基板。在未专门表示出材料名称的情况下,多数为陶瓷PGA,用于高速大规模逻辑LSI 电路。成本较高。引脚中心距通常为2.54mm,引脚数从64 到447 左右。 为了降低成本,封装基材可用玻璃环氧树脂印刷基板代替。也有64~256 引脚的塑料PGA。 另外,还有一种引脚中心距为1.27mm 的短引脚表面贴装型PGA(碰焊PGA)。

 

PGA SOCKET

PGA测试座 PGA老化座 PGA Socket
3M™ Textool™ PGA Sockets
part #200-4660-14-1900
• Lever actuated zero insertion force mechanism
• Rugged 3-plate construction for durability and electrical reliability
• Available with flush handle option for use with test probes and ease of board stacking
• Available in 10 x 10 through 25 x 25 matrices
• Contacts, handles, top-plate and cam plate are replaceable

PGA SOCKET

PGA测试座 PGA老化座 PGA Socket

3M™ Textool™ PGA Kit Sockets
• Available in 10 x 10 matrix through 25 x 25 matrix
• Used when only a few test sockets are needed
• Provides individual components ready for assembly
• Open pattern top plate; load only those contacts needed for your specific device pin pattern

Part Number Matrix Size Description MFR.
200-6310-9UN-1900 10 x 10 Socket Kit w/o Contacts 3M Textool
200-6311-9UN-1900 11 x 11 3M Textool
200-6313-9UN-1900 13 x 13 3M Textool
200-6315-9UN-1900 15 x 15 3M Textool
200-6317-9UN-1900 17 x 17 3M Textool
200-6319-9UN-1900 19 x 19 3M Textool
200-6321-9UN-1900 21 x 21 3M Textool
200-6325-9UN-1900 25 x 25 3M Textool
300-6300-CNA-0002B Each Contact - BeCu/Au Plated 3M Textool
200-4660-14-1900 Set of 10 Extra Hole Plugs 3M Textool
 
SPGA SOCKET
SPGA测试座 SPGA老化座 SPGA Socket
3M™ Textool™ Shrink PGA Sockets
• Applicable package for 1.27 mm (.050") pitch PGA
• Zero insertion force
• Double mating contact
• Lever actuation mechanism
• Maximum grid 37 x 37 and lead count of 600

IPGA SOCKET
IPGA测试座 IPGA老化座 IPGA Socket
3M™ Textool™ Interstitial PGA Sockets
• 17 x 17 outer matrix with 16 x 16 inner staggered matrix holds up to 432 leads
• Lever actuated zero insertion force mechanism
• Rugged 3-plate construction for durability and electrical reliability
• Accommodates two lead diameter variations
.25 - .40 mm (.010" - .016") and
.35 - .51 mm (.014" - .020")

PGA SOCKET
PGA测试座 PGA老化座 PGA Socket
WELLS-CTI 650/651 Series ZIP PGA Socket
• Zero Insertion Force with normally closed contacts
• 650 Series has Left side actuation
• 651 Series has Right side actuation
• High normal force Dual Beam contacts
• Chamfered lead-in area for easy insertion of IC contacts
• Normally closed balance beam contacts maintain constant pressure on device leads.
• Designed for fully automatic loading and unloading of devices
• Stress-free socket during burn-in

IPGA SOCKET
IPGA测试座 IPGA老化座 IPGA Socket
WELLS-CTI 681 Series ZIF IPGA Socket
• Zero Insertion Force with normally closed contacts
• Horizontal and vertical detents allow positive handle locations
• Chamfered lead-in area for easy insertion of IC contacts
• Keyed hole plug available for device orientation
• Heatsink option available with thermal transfer interface

PGA SOCKET
PGA测试座 PGA老化座 PGA Socket
WELLS-CTI 682 Series ZIF PGA Socket
• Zero Insertion Force with normally closed contacts
• Horizontal and vertical detents allow positive handle locations
• Chamfered lead-in area for easy insertion of IC contacts
• Keyed hole plug available for device orientation

PGA SOCKET
PGA测试座 PGA老化座 PGA Socket
WELLS-CTI 683 Series ZIF PGA Socket
• Zero Insertion Force with normally closed contacts
• Horizontal and vertical detents allow positive handle locations
• Chamfered lead-in area for easy insertion of IC contacts


Part Number Body Size Grid Row/Array Leads Pitch MFR.
PGA-296(420)-1.78-01 49.53X49.53 37X37 Staggered 296 1.78 ENPLAS
PGA-296(420)-1.78-02 49.53X49.53 37X37 Staggered 296 1.78 ENPLAS

 

 

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