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Click on Data Sheet for further information
about:
-Part Number Details
-Socket
Dimensions
-IC Dimensions
-PCB
Layout
-Contact Details
Full Data Sheet |
PDF file size:
33KB |
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Title: Thin Small Outline Package (TSOP
II) |
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Features |
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Specifications |
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Insulation Resistance: |
1,000M min. at 500V DC |
Dielec. Withstd. Voltage: |
700V AC for 1 minute |
Contact Resistance: |
30m max. at 10mA/20mV max. |
Current Rating: |
1A max. |
Operating Temp. Range: |
–40癈 to +150癈 |
Mating Cycles: |
10,000 insertions min. |
Contact Force: |
45g +/- 15g per pin |
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Materials and Finish |
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Housing: |
Polyetherimide (PEI), glass-filled |
Contacts: |
Beryllium Copper (BeCu) |
Plating: |
Gold over
Nickel |
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