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Click on Data Sheet for further information
about:
-Part Number Details
-Socket
Dimensions
-IC Dimensions
-PCB
Layout
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16 to 38 pins
(PDF file size:
88KB)
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40 to 54 pins
(PDF file
size: 107KB)
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56 to 88 pins
(PDF file size:
115KB)
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Title: Small Outline Package (SOP, SSOP,
TSOP) |
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Features |
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Specifications |
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Insulation
Resistance: |
1,000M min. at 100V DC, pitch 0.4, 0.5
1,000M min. at 500V DC, pitch 0.65, 0.8,
1.27 |
Dielec.
Withstd.
Voltage: |
for 1 minute
at 100 V AC, pitch 0.4, 0.5
for 1
minute at 500 V AC, pitch 0.65
for 1
minute at 700 V AC, pitch 0.8, 1.27 |
Contact
Resistance: |
30m max. at 10mA/20mV max. |
Op. Temp.
Range: |
–40癈 to
+150癈 |
Contact
Force: |
20g min. per
pin at min. displacement of 0.3mm
80g max.
per pin at max.displacement of 0.7mm |
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Materials
and Finish |
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Housing: |
Polyetherimide (PEI), glass-filled |
Contacts: |
Beryllium
Copper (BeCu) |
Plating: |
Gold over
Nickel |
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