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YED514 / 550 /558



Click on Data Sheet for further information about:
-Part Number Details
  for Socket / Carrier
-Socket Dimensions
-Carrier Dimensions
-Pin Counts (max.)
-Personalized Grid
-Contact Details

Full Data Sheet

PDF File: 135KB
 
Title: Ball Grid Array with Carrier Sytem - SMT  (BGA)
 
Features
  • Contacts are arranged in grid paterns with a pitch of 1.00, 1.50, 1.27and 2.54mm. Any pin count and pin layout within the given grids is available
  • The best way to make BGA pluggable without
    changing layout design
  • The socket and PCB adapter provide a high density
    and low profile board interconnect system
 
Specifications
Insulation Resistance: 10,000M min. at 500VRMS
Dielec. Withstd. Voltage: 500VRMS
Max Working Voltage 100Vrms/150VDC for >1.27mm
Max Working Voltage 50Vrms/60VDC for >1.00mm
Contact Resistance: 10m max. at 100mA/20mV
Current Rating: 1A 
Operating Temp. Range: -55癈 ~  +125癈
Capacitance: max. 1pF at 1kHz 
Mating Cycles: max. 2nH per pin.
Mating Cycles: 100 insertions min.
Materials and Finish
Insulator: Laminated glass-epoxy FR4  UL94V-0
Contacts(stamped): Beryllium Copper, clip Gold over Nickel
Sleeve (machined): Brass, Tin Lead over Nickel
Adapter Pins (machined): Brass, Gold over Nickel

 

 

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