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Click on Data Sheet for further information about:
-Part Number
Details
-Socket Dimensions
-PCB Layouts
-Matching IC Dim.
Full Data Sheet |
PDF file size:
66KB |
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Title: Interstitial Pin Grid Array
(PGA) |
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Features |
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- Push-down frame
for automated handling
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Specifications |
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Insulation Resistance: |
1,000M min. at 500V DC |
Dielec. Withstd.
Voltage: |
700V AC
for 1 minute |
Contact
Resistance: |
30m max. at
10mA/20mV max. |
Operating Temp. Range: |
–55癈
to +170癈 |
Contact
Force: |
30g
min. per pin at min.
displacement of 0.45mm
120g max. per pin at
max.
displacement of
0.8mm |
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Materials
and Finish |
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Housing: |
Polyetherimide
(PEI), glass-filled |
Contacts: |
Beryllium Copper
(BeCu) |
Plating: |
Gold over
Nickel |
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