|
Click on Data Sheet for further information about:
-Part Number
Details
-Socket Dimensions
-IC Dimensions
-PCB Layout
Full Data Sheet |
PDF file size:
93KB |
|
Title: Bumper Quad Flat Package
(BQFP) |
|
|
Features |
|
|
|
|
|
|
Specifications |
|
Insulation Resistance: |
1,000M min. at 500V DC |
Dielec. Withstd. Voltage: |
700C AC for 1minute |
Contact Resistance: |
30m max. at 10mA/20mV max. |
Operating Temp. Range: |
–55癈 to +170癈 |
Mating
Cycles: |
25,000 insertions min. |
Contact Force: |
50g min. per pin at min.
displacement of
0.3mm
150g max. per pin at max.
displacement of 0.7mm |
|
|
Materials and Finish |
|
Housing: |
Polyetherimide (PEI), glass-filled |
Contacts: |
Beryllium
Copper (BeCu) |
Plating: |
Gold over
Nickel |
|
|