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Click on Data Sheet for further information about:
-Part Number Details
-Socket Dimensions
-PCB Layout
-Matching IC Dim.
Full Data Sheet |
PDF file size: 41KB |
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Title: Ball Grid Array (BGA) |
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Features |
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- Open top type sockets for BGA packages, with push-down frame for automated handling
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Specifications |
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Insulation Resistance: |
1,000M min. at 500V DC |
Dielec. Withstd. Voltage: |
100V AC for 1 minute |
Contact Resistance: |
1 max. at 10mA/20mV
max. |
Operating Temp. Range: |
–40癈 to +150癈 |
Mating Cycles: |
10,000 insertions min. |
Contact force: |
25g to 35g per individual
contact pin |
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Materials and Finish |
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Housing: |
Polyetherimide (PEI), glass-filled |
Contacts: |
Beryllium Copper (BeCu) |
Plating: |
Gold over Nickel |
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