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Title: Quad Flat Package
(QFP) |
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Features |
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- Pitch
sizes 0.4, 0.5, 0.65 and 0.8mm
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- Open
top sockets for QFP packages using a shoulder contact
system
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- Universal socket for both long and short IC
leads
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- Contact
system protects the IC lead from wear and tear during
testing
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Specifications |
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Insulation
Resistance: |
1,000M min. at 100V DC, pitch
0.4, 0.5
1,000M min. at 500V DC, pitch 0.65, 0.8 |
Dielec. Withstd.
Voltage: |
for 1 minute at
100V AC, pitch 0.4, 0.5
for 1 minute at
500V AC, pitch 0.65
for 1 minute at
700V AC, pitch 0.8 |
Contact
Resistance: |
30m max. at 10mA/20mV
max. |
Operating Temp.
Range: |
–40癈 to
+150癈 |
Contact
Force: |
20g to 80g per
pin |
Mating
Cycles: |
10,000 insertions
min.
5,000 insertions min.,
(IC234-1004-009) |
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Materials and Finish |
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Housing: |
Polyetherimide (PEI), glass-filled
Polyethersulphone (PES), glass-filled |
Contacts: |
Beryllium Copper (BeCu) |
Plating: |
Gold over
Nickel |
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