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Click on Data Sheet for further information
about:
-Part Number Details
-Socket
Dimensions
-IC Dimensions
-PCB Layout
Full Data Sheet |
PDF file size:
80KB |
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Title: Bumper Quad Flat Package
(BQFP) |
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Features |
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Specifications |
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Insulation
Resistance: |
1,000M min. at 500V
DC |
Dielec. Withstd.
Voltage: |
500V AC for 1
minute |
Contact
Resistance: |
30m max. at 10mA/20mV
max. |
Operating Temp.
Range: |
–40癈 to
+170癈 |
Contact
Force: |
20g min. per pin at
min. displacement of 0.3mm
80g max. per pin at max.
displacement of 0.7mm |
Mating Cycles: |
10,000 insertions |
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Materials and Finish |
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Housing: |
Polyetherimide (PEI), glass-filled |
Contacts: |
Beryllium Copper (BeCu) |
Plating: |
Gold over
Nickel |
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