Features

• Pin count 48 to 1849

• Pitch size 1.00mm

• Open top type sockets for FBGA packages

• Self contacting structure without upper pressingforce (ZIF)

• Contacting structure to nip the sides of solder balls to lower damages of coplanarity of solder balls

Specifications

Insulation Resistance:

1,000M min. at 100V DC

Dielec. Withstd. Voltage:

100V AC for 1 minute

Contact Resistance:

100m max. at 10mA/20mV max.

Operating Temp. Range:

–40癈 to +150癈
–55癈 to +150癈

Contact force:

15g per pin approx.

Mating Cycles:

10,000 insertions min.

Materials and Finish

Housing:

Polyetherimide (PEI), glass-filled
Polyetherssulphone (PES), glass-filled

Contacts:

Beryllium Copper (BeCu)

Plating:

Gold over Nickel