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Click on Data Sheet for further information about:
-Part Number Details
for Socket / Carrier
-Socket Dimensions
-Carrier Dimensions
-Pin Counts (max.)
-Personalized Grid
-Contact Details
 Full Data Sheet
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| PDF File: 135KB |
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| Title: Ball Grid Array with Carrier Sytem - SMT (BGA) |
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| Features |
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- Contacts are arranged in grid paterns with a pitch of 1.00, 1.50, 1.27and 2.54mm. Any pin count and pin layout within the given grids is available
- The best way to make BGA pluggable without
changing layout design
- The socket and PCB adapter provide a high density
and low profile board interconnect system
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| Specifications |
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| Insulation Resistance: |
10,000M min. at 500VRMS |
| Dielec. Withstd. Voltage: |
500VRMS |
| Max Working Voltage |
100Vrms/150VDC for >1.27mm |
| Max Working Voltage |
50Vrms/60VDC for >1.00mm |
| Contact Resistance: |
10m max. at 100mA/20mV |
| Current Rating: |
1A |
| Operating Temp. Range: |
-55癈 ~ +125癈 |
| Capacitance: |
max. 1pF at 1kHz |
| Mating Cycles: |
max. 2nH per pin. |
| Mating Cycles: |
100 insertions min. |
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| Materials and Finish |
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| Insulator: |
Laminated glass-epoxy FR4 UL94V-0 |
| Contacts(stamped): |
Beryllium Copper, clip Gold over Nickel |
| Sleeve (machined): |
Brass, Tin Lead over Nickel |
| Adapter Pins (machined): |
Brass, Gold over Nickel |
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