|
|
| Title: Small Outline Package
(SOP) |
| |
|
| Features |
|
|
- Pitch sizes 0.8,
1.25 and 1.27mm
|
|
| |
|
| Specifications |
|
| Insulation Resistance: |
1,000M min. at 500V DC |
| Dielec. Withstd. Voltage: |
700V AC for 1 minute |
| Contact Resistance: |
30m max. at 10mA/20mV max. |
| Operating Temp. Range: |
–40癈 to +150癈
(type
PSF)
–55癈 to +170癈
(type PES
& PEI) |
| Mating Cycles: |
10,000 insertions min. |
| |
|
| Materials and Finish |
|
| Housing: |
Polysulphone (PSF), glass-filled
Polyethersulphone (PES), glass- filled
Polyetherimide (PEI),
glass-filled |
| Contacts: |
Beryllium Copper (BeCu) |
| Plating: |
Gold over
Nickel |
|
|
8 to 18
pins